Ceramic substrates is refers to the direct bonding to the copper foil in the high temperature alumina (AL2Q3) or aluminum nitride (ALN) ceramic substrate surface (single side or double side) the special process on the plate. Ultra-thin composite substrate are made with good electrical insulating performance, high thermal conductivity properties, excellent soft soldering resistance and high adhesion strength, and is like a PCB can be carved a variety of graphics, has a great deal of current-carrying capacity. Ceramic substrates, therefore, has become a high-power power electronic circuit structure and interconnection technology based materials.

USES:

Pieces of high-power electric power semiconductor module; Semiconductor refrigerator, electronic heater; Power control circuit, power hybrid circuit.

Pieces of smart power components; High frequency switching power supply, solid state relay.

Automotive electronics, aerospace and military electronic components.

Pieces of solar panels components; Telecommunications PBX, receiving system; Laser and other industrial electronics.

Features:

Mechanical stress is strong, stable shape; High strength, high thermal conductivity, high insulation; Strong adhesion, corrosion resistance.

Excellent performance of thermal cycle, cycle number up to 50000 times, high reliability.

In pieces and PCB (or IMS substrate) can be etched out various graphical structure; Pollution-free, pollution-free.

In pieces with wide temperature - 55 ℃ ~ 850 ℃; Thermal expansion coefficient is close to silicon, simplify the production process of power module.

Advantages:

Pieces of ceramic substrate thermal expansion coefficient is close to the silicon chip, can save the transition layer of Mo, save work and material saving and cost reduction;

Mixer reduce weld layer, lower thermal resistance, reduce the empty, improve yield;

Pieces of 0.3 mm thick copper foil under the same load flow line width is only 10% of that in the common printed circuit board;

Good thermal conductivity, the encapsulation of the chip is very compact, which greatly improve the power density, improve the reliability of the system and device;

Pieces ultra thin (0.25 mm) ceramic substrate alternative BeO, no toxicity of environmental problems;

Continuous mixer carrying capacity is big, 100 a current by 1 mm width 0.3 mm thick copper body, the temperature is about 17 ℃; 100 a current for 2 mm wide by 0.3 mm thick copper body, only the temperature of 5 ℃ or so;

Low thermal resistance, 10 x 10 mm ceramic substrate, the thermal resistance of 0.63 mm thickness of the ceramic substrate thermal resistance is 0.31 K/W, 0.38 mm thickness of the ceramic substrate thermal resistance is 0.19 K/W, 0.25 mm thickness of the ceramic substrate thermal resistance is 0.14 K/W.

High voltage insulation, guarantee personal safety and equipment protection.

Can implement the new packaging and assembly method, make our products highly integrated, smaller.